WIRED AND WIRELESS
CHARGING SOLUTIONS
Build on Infineon’s 20+ years of expertise in this field
Power up your devices with Infineon’s charging technology
Choose from a broad offering of semiconductors enabling safe and efficient charging. Infineon’s solutions support multiple applications ranging up to 240 watts.
Wired charging ICs
XDP™ digital power XDPS2201
Hybrid flyback controller
The XDP™ XDPS2201 is a digital controller based on an asymmetric half-bridge flyback topology. It combines the simplicity of a traditional flyback with the performance of a resonant converter. Such a combination allows natural soft-switching to reduce switching losses enabling high switching frequency designs. Furthermore, the XDPS2201 comes with an integrated high-side driver saving up to 20 external components. Benefit from reduced BOM and lower cost.
EZ-PD™ PAG1
Integrated QR flyback chipset
- Highly integrated 2-chip power adapter solution including SR+PD controller, all necessary protection circuitry, and FET drivers to drive the primary, SR, and load FETs
- EZ-PD™ PAG1P: primary start-up controller
- EZ-PD™ PAG1S: secondary-side controller
- Flexibility to program the device according to the customer’s needs, to configure the parameters across multiple platforms as well as to upgrade the firmware on the field
- Reduced BOM
EZ-PD™ CCG3PA
Highly integrated USB Type-C port controller
- Supports one USB type-C port and one type-A port
- Supports USB Power Delivery 3.0 PPS
- Supports the legacy protocols including Qualcomm QC4.0, Apple charging 2.4 A, AFC, BC 1.2 at no additional BOM cost
- Programmable USB-C controller offering the flexibility to implement custom features and upgrade the firmware on the field
- Integrates voltage regulation and current sense amplifier
- Integrates 30 V-tolerant regulator
- On-chip OVP, OCP, UVP, SCP, and VBUS to CC short protection
- Integrates a PFET VBUS gate driver
- Integrated system-level ESD on VBUS, CC, and DP/DM
- Packages: 24-pin QFN and 16-pin SOIC
- Supports extended industrial temperature range (-40 °C to +105 °C)
EZ-PD™ CCG3PA-NFET
Highly integrated USB Type-C port controller with integrated NFET gate driver
- Supports one USB Type-C port
- Supports USB Power Delivery 3.0 PPS
- Supports the legacy protocols including Qualcomm QC4.0, Apple charging 2.4A, AFC, BC 1.2 at no additional BOM cost
- Independent CC-CV loop
- Integrates VBUS NFET gate driver
- Programmable USB-C controller offering the flexibility to implement custom features and upgrade the firmware on the field
- On-chip OVP, OCP, UVP, SCP, and VBUS to CC Short protection
- Available in 24-pin QFN
EZ-PD™ CCG7DC
Industry‘s first dual-port PD controller + DC-DC controller
- Integrates 2 USB-C PD controllers + 2 DC-DC controllers in one single chip
- Supports latest USB-C PD v3.0 with PPS, QC4+, QC4.0, Samsung AFC, Apple 2.4 A, BCv1.2
- DC-DC controller: configurable switching frequency of
150 kHZ – 600 kHZ, wide input voltage range of 4V – 24V
(40 V tolerant), and programmable spread spectrum frequency for low EMI - ARM® Cortex®-M0 with Flash allows users to implement custom features
- Integrates VBUS NFET gate drivers, buck-boost NFET gate drivers, VCONN FETs and high-side current sense amplifier (HSCSA)
- Protection features: OVP, UVP, SCP, OCP, OTP and VBUS-CC
- Advanced features: dynamic load sharing, signed field firmware upgrade, and optimized buck input voltage for higher efficiency
- Package: 68-pin QFN (8 mm x 8 mm)
- Packing type: tray
Wireless charging ICs
WLC1115
15 W transmitter
- Qi & proprietary transmitter up to 15 W
- USB-PD or DC input
- Fixed frequency, variable voltage control via integrated DC/DC
- Integrated gate drivers for full bridge inverter and DC/DC
- Adaptive foreign object detection (FOD)
- Supports PPDE charging extensions
- Graphical configuration utility with static configuration
- ModusToolbox™ software library
WLC1150
50 W transmitter
- Qi & proprietary transmitter up to 50 W
- USB-PD or DC input
- Variable frequency, phase control and optional voltage control via USB-PD/PPS
- Integrated gate drivers for full bridge inverter and fan supply
- Adaptive foreign object detection (FOD)
- Supports vendor messages with Infineon receiver
- Graphical configuration utility with static, dynamic & updated FOD configuration
- ModusToolbox™ software library
High and low voltage switches
CoolGaN™ integrated power stage 600 V
GaN-based integrated power stage
Infineon’s state-of-the-art GaN switch with dedicated drivers in a half-bridge power stage design with a thermally enhanced QFN package solution.
- Voltage class: 600 V
- Package: QFN-28
- On-state resistance:
140 – 500 mΩ RDS(on) - Key benefits:
- Superior switching behavior
- Highest efficiency
- Small form factors
- Light designs
CoolGaN™ GIT HEMTs 600 V
GaN-based high-voltage switches
- Voltage class: 600 V
- Small packages: ThinPAK 5x6, DFN 8x8, TO-leadless, DSO-20-85, DSO-20-87
- On-state resistance:
70 – 340 mΩ RDS(on) - Key benefits:
- Outstanding performance
- Highest power density
- Superior dynamic on-state resistance
- Low gate charge enabling turn-on with low current
CoolMOS™ SJ MOSFETs
Silicon-based high-voltage switches
- Voltage classes: 600 V, 650 V, 700 V
- Small packages: SOT-223, TO-220 FP, ThinPAK8x8, DPAK
- Key benefits:
- competitive price
- excellent ease-of-use and thermal performance
- high efficiency
- good EMI
OptiMOS™ power MOSFETs
Low-voltage load switches and synchronous rectification devices
- Voltage classes: 25 V – 150 V
- Small packages: PQFN 3.3x3.3, Super-SO8
- Key benefits:
- BOM cost reduction
- Excellent thermal behavior
- Superior price/performance ratio
- Enabling smallest form factors
Block Diagrams
USB-C adapters and chargers
Wireless charging
